Molecular Formula | BCuF4+ |
Molar Mass | 150.35 |
Density | 2.175 |
Water Solubility | Soluble in water. Slightly soluble in alcohol. |
Vapor Presure | 0.001Pa at 20℃ |
Appearance | Liquid |
Color | Blue |
Exposure Limit | ACGIH: TWA 1 mg/m3; TWA 2.5 mg/m3NIOSH: IDLH 100 mg/m3; IDLH 250 mg/m3; TWA 1 mg/m3 |
Storage Condition | under inert gas (nitrogen or Argon) at 2-8°C |
Physical and Chemical Properties | Properties: solid copper fluoroborate is bright blue needle-like crystal. Moist. relative density 2.175 solubility: very soluble in water. |
Use | Low temperature welding for lead plating and tin-lead |
Risk Codes | R22 - Harmful if swallowed R34 - Causes burns |
Safety Description | S20 - When using, do not eat or drink. S23 - Do not breathe vapour. S26 - In case of contact with eyes, rinse immediately with plenty of water and seek medical advice. S36/37/39 - Wear suitable protective clothing, gloves and eye/face protection. S45 - In case of accident or if you feel unwell, seek medical advice immediately (show the label whenever possible.) S60 - This material and its container must be disposed of as hazardous waste. |
UN IDs | 1759 |
TSCA | Yes |
HS Code | 28261990 |
Hazard Class | 8 |
Packing Group | III |
Blue needle-like crystals. Soluble in water. Slightly soluble in alcohol, ether. Easy to form complexes with water and ammonia.
prepared by reacting copper oxide with fluoroboric acid, filtering and drying. Alternatively, fluoroboric acid may be reacted with basic copper carbonate, filtered, and the solution may be evaporated.
The composition of copper and copper alloy electroplating solution, copper smelting and welding additives, and coloring agents for printing and dyeing, photography and so on.
see boron trifluoride. Packaging with polyethylene barrels or chemical packaging barrels. 25kg or 250kg net weight per barrel. Should be stored in a cool, dry warehouse. The packaging is sealed. Cannot be stored in a hot depot or exposed to sunlight. During transportation, it should be protected from rain and sunlight. Prevent breakage of packaging.
LogP | -1 at 20℃ |
EPA chemical information | Information provided by: ofmpub.epa.gov (external link) |
use | low temperature soldering for lead plating and tin-lead |
production method | it is prepared by reacting copper oxide with fluoroboric acid, filtering and drying. Or by reacting fluoroboric acid with basic copper carbonate, filtering, and evaporating the solution. |