Molecular Formula | C6H12NNaO3S3 |
Molar Mass | 265.35 |
Density | 1.478-1.49g/cm3 at 22℃ |
Boling Point | 245.5°C at 760 mmHg |
Flash Point | 102.3°C |
Vapor Presure | 0.0286mmHg at 25°C |
Appearance | White to light yellow powder |
Storage Condition | Room Temprature |
Refractive Index | 1.654 |
LogP | -3.54 |
EPA chemical information | Information provided by: ofmpub.epa.gov (external link) |
use | as an intermediate of electroplating additive, used to prepare copper plating brightener to make it have good ductility and brightness copper plating brightener can be used in combination with surfactants such as polyether and wetting agent, or in combination with other sulfur-containing brightener to obtain a coating with good bright ductility. At the same time, it can also be used for electroless plating of precious metals and as an electroplating stabilizer. DPS belongs to brightener in medium current density region. The product was first introduced into China by German RASCHIG Company. Its main function is fast light output and good stability of plating solution. The general usage method: use it in conjunction with SPS. For high-quality SPS, SPS and DPS are used in conjunction with 1:1, while for ordinary SPS purchased in the market, the proportion should be adjusted because it contains DPS components. After adding DPS, electroplating failures can be reduced, it can adjust the balance of SPS, M, and N, and can complex monovalent copper ions. |