tetraphenyl m-phenylene bis(phosphate)
tetraphenyl m-phenylene bis(phosphate)
CAS: 57583-54-7
Molecular Formula: C30H24O8P2
tetraphenyl m-phenylene bis(phosphate) - Names and Identifiers
| Name | tetraphenyl m-phenylene bis(phosphate) |
| Synonyms | PFR RDP CR 733S LDP 301 Reofos RDP ADK Stab PFR Fyrolflex RDP DAIHACHI CR-733S Bis(diphenyl phosphate) Resorcinol Tetraphenyl Diphosphate Resorcinol Bis (diphenyl phosphate) Tetraphenyl M-Phenylene Diphosphate 1,3-Phenylene Bis(diphenyl phosphate) tetraphenyl m-phenylene bis(phosphate) benzene-1,3-diyl tetraphenyl bis(phosphate) Tetraphenyl resorcinol bis(diphenylphosphate) TETRAPHENYLRECORCINOL BIS(DIPHENYL PHOSPHATE), TECHN. (2,3,4,6-tetraphenyl-5-phosphonatooxy-phenyl) phosphate |
| CAS | 57583-54-7 |
| EINECS | 260-830-6 |
| InChI | InChI=1/C30H24O8P2/c31-39(32,33)37-29-26(22-15-7-2-8-16-22)25(21-13-5-1-6-14-21)27(23-17-9-3-10-18-23)30(38-40(34,35)36)28(29)24-19-11-4-12-20-24/h1-20H,(H2,31,32,33)(H2,34,35,36)/p-4 |
tetraphenyl m-phenylene bis(phosphate) - Physico-chemical Properties
| Molecular Formula | C30H24O8P2 |
| Molar Mass | 574.45 |
| Density | 1.347 |
| Boling Point | 587.1±33.0 °C(Predicted) |
| Flash Point | 410.4°C |
| Solubility | Chloroform (Sparingly), Ethyl Acetate (Slightly), Methanol (Slightly) |
| Vapor Presure | 6.02E-24mmHg at 25°C |
| Appearance | Oil |
| Color | Colourless to Pale Yellow |
| Storage Condition | Refrigerator, Under Inert Atmosphere |
| Stability | Moisture Sensitive |
tetraphenyl m-phenylene bis(phosphate) - Reference Information
| EPA chemical substance information | information provided by: ofmpeb.epa.gov (external link) |
| Application | resorcinol tetraphenyl diphosphate may be used to prepare a thermosetting cyanate ester resin composition comprising the following components: polyfunctional Cyanate esters, epoxy resins and flame retardants. The thermosetting cyanate ester resin composition further comprises an inorganic filler. The thermosetting resin composition of the present invention is useful for preparing resin sheets, resin composite metal copper foils, prepregs, laminates, copper clad laminate, Printed Wiring Boards, and the like. The resin composition of the present invention is excellent in heat resistance, moisture resistance, flame retardancy and low coefficient of thermal expansion. The phosphorus-based flame retardant is selected from the group consisting of Tris (2, 6-dimethylphenyl) phosphine, resorcinol bis [BIS (2, 6-dimethylphenyl) phosphate], resorcinol tetraphenyl diphosphate, and the like. |
Last Update：2024-04-10 22:29:15
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