| ID | 中文名 | 英文名 | CAS | 用途 |
|---|---|---|---|---|
| 1 | 底部填充胶,镝普材料,底填胶线路板/BGA底部填充胶 单组份低温固化/芯片胶 胶水 | Bottom filling adhesive, dysprosium material, bottom filling adhesive circuit board/BGA bottom filling adhesive one-component low-temperature curing/chip adhesive | ||
| 2 | 透镜成型液态胶,镝普材料7816透镜成型胶,Mini LED 芯片封装胶 | Liquid lens forming adhesive, Dysprosium 7816 lens forming adhesive, Mini LED chip packaging adhesive |