| 1 | 7440-50-8 | 铜 | Copper | Cu
| 铜;粉体;金属;无机盐;重金属;微生物;有机化工;制造用剂;镀膜材料;其它试剂 | 试剂 |
| 2 | 14191-84-5 | 铜-63 | Copper63 | Cu
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| 3 | | 铜丝 | Copper wire | Cu
| 金属粉末 | |
| 4 | | COPPER, 63CU | COPPER, 63CU | Cu
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| 5 | | 铜蚀刻剂 | COPPER ETCHANT | Cu
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| 6 | | 骨架铜催化剂(雷尼铜) | Copper activator | Cu
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| 7 | | 铜轧制专用油 | Copper rolling oil | Cu
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| 8 | | Copper pearl DY-217 | Copper pearl DY-217 | Cu
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| 9 | | 铜-65CU 溶液 | Copper-65Cu solution | Cu
| Alphabetic;Application CRMs;C;CO - CZCertified Reference Materials (CRMs);Physical Properties | |
| 10 | | COPPER MASKING REAGENT | COPPER MASKING REAGENT | Cu
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| 11 | | COPPER STANDARD REAGENT | COPPER STANDARD REAGENT | Cu
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| 12 | | COPPER STANDARD 1,00 G CU | COPPER STANDARD 1,00 G CU | Cu
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| 13 | | 抑铜剂 | Copper sequestrating agent | Cu
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| 14 | | COPPER SHOT (2-6MM) (CU) 5G | COPPER SHOT (2-6MM) (CU) 5G | Cu
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| 15 | | JC-832铜清洗剂 | copper cleaning agent JC-832 | Cu
| 化工助剂;其他药剂;水处理化学品 | |
| 16 | | 铜粉, 5% 在石墨上负载 | COPPER POWDER, 5% IN GRAPHITE | Cu
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| 17 | | COPPER 5 PPM STANDARD SOLUTION | COPPER 5 PPM STANDARD SOLUTION | Cu
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| 18 | | COPPER 10 PPM STANDARD SOLUTION | COPPER 10 PPM STANDARD SOLUTION | Cu
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| 19 | | 镀铜抑雾剂 ZM-41 | copper plating fog indibitor ZM-41 | Cu
| 化工助剂;电镀化学品 | |
| 20 | | 铜 ICP/DCP 标准溶液 | Copper ICP/DCP standard solution | Cu
| Alphabetic;C;CO - CZReference/Calibration Standards;ICP/DCP Standard SolutionsSpectroscopy;ICP-OES/-MS;Matrix Selection;NitrateSpectroscopy;Single Solution;Standard Solutions | |
| 21 | | BC型铜粉导电胶 | copper powder conductive adhesive BC | Cu
| 导电胶;胶粘剂 | |
| 22 | | COPPER WIRE DIAMETER 0.5 MM PACKAGE W | COPPER WIRE DIAMETER 0.5 MM PACKAGE W | Cu
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| 23 | | COPPER TUBING O.D. 1/4IN. I.D. 3/16IN. | COPPER TUBING O.D. 1/4IN. I.D. 3/16IN. | Cu
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| 24 | | COPPER 10,000 PPM ICP STANDARD SOLUTION | COPPER 10,000 PPM ICP STANDARD SOLUTION | Cu
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| 25 | | COPPER ATOMIC ABSORPTION STANDARD SOLUT& | COPPER ATOMIC ABSORPTION STANDARD SOLUT& | Cu
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| 26 | | COPPER POWDER, -100 MESH, 99% (METALS BASIS) | COPPER POWDER, -100 MESH, 99% (METALS BASIS) | Cu
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| 27 | | COPPER POWDER, -150 MESH, 99.5% (METALS BASIS) | COPPER POWDER, -150 MESH, 99.5% (METALS BASIS) | Cu
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| 28 | | COPPER POWDER, -100 MESH, 99.999% (METALS BASIS) | COPPER POWDER, -100 MESH, 99.999% (METALS BASIS) | Cu
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| 29 | | COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS) | COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS) | Cu
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| 30 | | COPPER NAPHTHENATES SOLUTION 100UG/ML IN TOLUENE 1ML | COPPER NAPHTHENATES SOLUTION 100UG/ML IN TOLUENE 1ML | Cu
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| 31 | | COPPER WIRE, 1.5MM (0.06IN) DIA, 99.9% (METALS BASIS) | COPPER WIRE, 1.5MM (0.06IN) DIA, 99.9% (METALS BASIS) | Cu
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| 32 | | 254系列铜粉导电胶 | copper powder electric conductive adhesives 254 series | Cu
| 导电胶;胶粘剂 | |
| 33 | | COPPER FOIL, 1.27MM (0.05IN) THICK, 99.9% (METALS BASIS) | COPPER FOIL, 1.27MM (0.05IN) THICK, 99.9% (METALS BASIS) | Cu
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| 34 | | 铜等离子体标准溶液, SPECPURE|R, CU 10^MG/ML | Copper, plasma standard solution, Specpure|r, Cu 10^mg/ml | Cu
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| 35 | | COPPER SHOT, 0.6-0.8MM (0.02-0.03IN), 99.5% (METALS BASIS) | COPPER SHOT, 0.6-0.8MM (0.02-0.03IN), 99.5% (METALS BASIS) | Cu
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| 36 | | 天然铜(同位素丰度比认证) | Copper natural (certified for isotope abundance ratio) | Cu
| Physical Properties CRMsMore...Close...;Physical PropertiesAnalytical Standards;Physical PropertiesCertified Reference Materials (CRMs);Alphabetic;Application CRMs;C;CO - CZCertified Refer | |
| 37 | | 铜等离子体标准溶液, SPECPURE|R, CU 10,000^MG/ML | Copper, plasma standard solution, Specpure|r, Cu 10,000^mg/ml | Cu
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| 38 | | COPPER POWDER, -625 MESH, APS 2-3.25 MICRON, 99% (METALS BASIS) | COPPER POWDER, -625 MESH, APS 2-3.25 MICRON, 99% (METALS BASIS) | Cu
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| 39 | | COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS) | COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS) | Cu
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| 40 | | COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS) | COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS) | Cu
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| 41 | | COPPER FOIL, 0.675MM (0.027IN) THICK, ANNEALED, 99.9% (METALS BASIS) | COPPER FOIL, 0.675MM (0.027IN) THICK, ANNEALED, 99.9% (METALS BASIS) | Cu
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| 42 | | COPPER WIRE, 0.5MM (0.02IN) DIA, PURATRONIC®, 99.999% (METALS BASIS) | COPPER WIRE, 0.5MM (0.02IN) DIA, PURATRONIC®, 99.999% (METALS BASIS) | Cu
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| 43 | | COPPER SHOT, 4-6MM (0.16-0.24IN), PURATRONIC®, 99.999% (METALS BASIS) | COPPER SHOT, 4-6MM (0.16-0.24IN), PURATRONIC®, 99.999% (METALS BASIS) | Cu
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| 44 | | COPPER FOIL, 1.0MM (0.04IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | COPPER FOIL, 1.0MM (0.04IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | Cu
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| 45 | | 铜65, ^6^5CU, 等离子体标准溶液 , SPECPURE|R, ^6^5CU 10^M | Copper 65, ^6^5Cu, plasma standard solution, Specpure|r, ^6^5Cu 10^mg/ml | Cu
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| 46 | | COPPER FOIL, 0.025MM (0.001IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | COPPER FOIL, 0.025MM (0.001IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | Cu
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| 47 | | COPPER TUBING, 6.35MM (0.25IN) OD, 4.72MM (0.186IN) ID, 99.9% (METALS BASIS) | COPPER TUBING, 6.35MM (0.25IN) OD, 4.72MM (0.186IN) ID, 99.9% (METALS BASIS) | Cu
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| 48 | | COPPER TUBING, 3.175MM (0.125IN) OD, 1.5MM (0.059IN) ID, 99.9% (METALS BASIS) | COPPER TUBING, 3.175MM (0.125IN) OD, 1.5MM (0.059IN) ID, 99.9% (METALS BASIS) | Cu
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| 49 | | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.99% (METALS BASIS) | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.99% (METALS BASIS) | Cu
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| 50 | | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.996% (METALS BASIS) | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.996% (METALS BASIS) | Cu
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| 51 | | COPPER SLUG, 3.175MM (0.125IN) DIA X 3.175MM (0.125IN) LENGTH, 99.995% (METALS BASIS) | COPPER SLUG, 3.175MM (0.125IN) DIA X 3.175MM (0.125IN) LENGTH, 99.995% (METALS BASIS) | Cu
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| 52 | | COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) | COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) | Cu
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| 53 | | COPPER PLATE, IRREGULAR, NOMINAL 10X34X0.6CM (4X13.5X0.25IN), PURATRONIC®, 99.999% (METALS BASIS) | COPPER PLATE, IRREGULAR, NOMINAL 10X34X0.6CM (4X13.5X0.25IN), PURATRONIC®, 99.999% (METALS BASIS) | Cu
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| 54 | 1325-32-2 | Copper, diazotized 2-methoxy-4-nitrobenzenamine-4-[(8-hydroxy-6-sulfo-2-naphthalenyl)amino]benzoic acid coupling products complexes | Copper, diazotized 2-methoxy-4-nitrobenzenamine-4-[(8-hydroxy-6-sulfo-2-naphthalenyl)amino]benzoic acid coupling products complexes | Cu
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| 55 | 90294-97-6 | Copper, diazotized 4-amino-3-hydroxy-7-nitro-1-naphthalenesulfonic acid-diazotized o-toluidine-resorcinol coupling products complexes | Copper, diazotized 4-amino-3-hydroxy-7-nitro-1-naphthalenesulfonic acid-diazotized o-toluidine-resorcinol coupling products complexes | Cu
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| 56 | 99148-46-6 | Copper, diazotized 3-amino-4-methoxybenzenesulfonic acid-diazotized 4-nitro-1,3-benzenediamine-resorcinol coupling products ammonium sodium complexes | Copper, diazotized 3-amino-4-methoxybenzenesulfonic acid-diazotized 4-nitro-1,3-benzenediamine-resorcinol coupling products ammonium sodium complexes | Cu
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| 57 | 92908-13-9 | Copper, diazotized 3-amino-5-chloro-4-hydroxybenzenesulfonic acid-2,2'-(1,2-ethenediyl)bis[5-nitrobenzenesulfonic acid]-3-methoxybenzenamine coupling products complexes | Copper, diazotized 3-amino-5-chloro-4-hydroxybenzenesulfonic acid-2,2'-(1,2-ethenediyl)bis[5-nitrobenzenesulfonic acid]-3-methoxybenzenamine coupling products complexes | Cu
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| 58 | 99148-45-5 | Copper, diazotized 3-amino-4-hydroxybenzenesulfonic acid-diazotized 2-(4-aminophenyl)-6-methyl-7-benzothiazolesulfonic acid-resorcinol coupling products ammonium sodium complexes | Copper, diazotized 3-amino-4-hydroxybenzenesulfonic acid-diazotized 2-(4-aminophenyl)-6-methyl-7-benzothiazolesulfonic acid-resorcinol coupling products ammonium sodium complexes | Cu
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| 59 | 72480-58-1 | Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes | Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes | Cu
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