| ID | CAS | Name | Synonyms | Molecular Formula | Category |
|---|---|---|---|---|---|
| 1 | 7440-50-8 | Copper | Copper C.I. 77400 Copper (O) copper(2+) Raney-Copper Copper ingot Copper (S, P) CoppershotNmm Copper powder Sponge copper Copper, Solid Bronze, powder Copperwiremmdia CopperturningsN Copper turnings CoppershotNmmdia CopperwireNmmdia Copper wire cloth CopperpowderNmesh Copper nanopowder Copper metal foil Copper metal wire CopperfoilNmmthick Electrolytic copper C.I. Pigment Metal 2 Copperpowderdendritic Copper solution 1000 ppm Copper shot(99.9) 1-10mm Copperpowdersphericalmesh CopperfoilNmmthickxmmwide Copper solution 10 000 ppm Copperpowdermeshunderargon raney-copper ready for use Copperwiresreducedfromoxide copper coating quality balzers Copper rod, 19mm (0.8 in.) dia. Copper wire (99.99) 0.25mm dia. Copper rod, 9.5mm (0.4 in.) dia. Copperwireclothmeshmmwidemmwiredia Electrolytic tough pitch copper (O) Electrolytic copper (trace elements) CopperrodNmmdiacElectrolytic copperagcm Copper, small rods for elemental analysis Copper with added impurities (trace elements) Copper gauze, Woven from 0.23mm (0.009 in.) dia. wire Copper gauze, Woven from 0.056mm (0.0022 in.) dia. wire Copper sputtering target, 50.8mm (2.0 in.) dia. x 6.35mm (0.250 in.) thick | ||
| 2 | 14191-84-5 | Copper63 | Copper63 Copper-63 isotope COPPER-63 METAL (63Cu) Copper, isotope of mass63 | ||
| 3 | Copper wire | Copper wire | |||
| 4 | COPPER, 63CU | COPPER, 63CU | |||
| 5 | COPPER ETCHANT | COPPER ETCH COPPER ETCHANT COPPER ETCHING SOLUTION | |||
| 6 | Copper activator | Copper activator | |||
| 7 | Copper rolling oil | Copper rolling oil | |||
| 8 | Copper pearl DY-217 | Copper pearl DY-217 | |||
| 9 | Copper-65Cu solution | Copper-65Cu solution | |||
| 10 | COPPER MASKING REAGENT | COPPER MASKING REAGENT | |||
| 11 | COPPER STANDARD REAGENT | COPPER STANDARD REAGENT | |||
| 12 | COPPER STANDARD 1,00 G CU | COPPER STANDARD 1,00 G CU | |||
| 13 | Copper sequestrating agent | Copper sequestrating agent | |||
| 14 | COPPER SHOT (2-6MM) (CU) 5G | COPPER SHOT (2-6MM) (CU) 5G | |||
| 15 | copper cleaning agent JC-832 | copper cleaning agent JC-832 | |||
| 16 | COPPER POWDER, 5% IN GRAPHITE | COPPER POWDER, 5% IN GRAPHITE | |||
| 17 | COPPER 5 PPM STANDARD SOLUTION | COPPER 5 PPM STANDARD SOLUTION | |||
| 18 | COPPER 10 PPM STANDARD SOLUTION | COPPER 10 PPM STANDARD SOLUTION | |||
| 19 | copper plating fog indibitor ZM-41 | copper plating fog indibitor ZM-41 | |||
| 20 | Copper ICP/DCP standard solution | Copper ICP/DCP standard solution | |||
| 21 | copper powder conductive adhesive BC | copper powder conductive adhesive BC | |||
| 22 | COPPER WIRE DIAMETER 0.5 MM PACKAGE W | COPPER WIRE DIAMETER 0.5 MM PACKAGE W | |||
| 23 | COPPER TUBING O.D. 1/4IN. I.D. 3/16IN. | COPPER TUBING O.D. 1/4IN. I.D. 3/16IN. | |||
| 24 | COPPER 10,000 PPM ICP STANDARD SOLUTION | COPPER 10,000 PPM ICP STANDARD SOLUTION | |||
| 25 | COPPER ATOMIC ABSORPTION STANDARD SOLUT& | COPPER ATOMIC ABSORPTION STANDARD SOLUT& | |||
| 26 | COPPER POWDER, -100 MESH, 99% (METALS BASIS) | COPPER POWDER, -100 MESH, 99% (METALS BASIS) | |||
| 27 | COPPER POWDER, -150 MESH, 99.5% (METALS BASIS) | COPPER POWDER, -150 MESH, 99.5% (METALS BASIS) | |||
| 28 | COPPER POWDER, -100 MESH, 99.999% (METALS BASIS) | COPPER POWDER, -100 MESH, 99.999% (METALS BASIS) | |||
| 29 | COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS) | COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS) | |||
| 30 | COPPER NAPHTHENATES SOLUTION 100UG/ML IN TOLUENE 1ML | COPPER NAPHTHENATES SOLUTION 100UG/ML IN TOLUENE 1ML | |||
| 31 | COPPER WIRE, 1.5MM (0.06IN) DIA, 99.9% (METALS BASIS) | COPPER WIRE, 1.5MM (0.06IN) DIA, 99.9% (METALS BASIS) | |||
| 32 | copper powder electric conductive adhesives 254 series | copper powder electric conductive adhesives 254 series | |||
| 33 | COPPER FOIL, 1.27MM (0.05IN) THICK, 99.9% (METALS BASIS) | COPPER FOIL, 1.27MM (0.05IN) THICK, 99.9% (METALS BASIS) | |||
| 34 | Copper, plasma standard solution, Specpure|r, Cu 10^mg/ml | Copper, plasma standard solution, Specpure|r, Cu 10^mg/ml | |||
| 35 | COPPER SHOT, 0.6-0.8MM (0.02-0.03IN), 99.5% (METALS BASIS) | COPPER SHOT, 0.6-0.8MM (0.02-0.03IN), 99.5% (METALS BASIS) | |||
| 36 | Copper natural (certified for isotope abundance ratio) | Copper natural (certified for isotope abundance ratio) | |||
| 37 | Copper, plasma standard solution, Specpure|r, Cu 10,000^mg/ml | Copper, plasma standard solution, Specpure|r, Cu 10,000^mg/ml | |||
| 38 | COPPER POWDER, -625 MESH, APS 2-3.25 MICRON, 99% (METALS BASIS) | COPPER POWDER, -625 MESH, APS 2-3.25 MICRON, 99% (METALS BASIS) | |||
| 39 | COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS) | COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS) | |||
| 40 | COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS) | COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS) | |||
| 41 | COPPER FOIL, 0.675MM (0.027IN) THICK, ANNEALED, 99.9% (METALS BASIS) | COPPER FOIL, 0.675MM (0.027IN) THICK, ANNEALED, 99.9% (METALS BASIS) | |||
| 42 | COPPER WIRE, 0.5MM (0.02IN) DIA, PURATRONIC®, 99.999% (METALS BASIS) | ||||
| 43 | COPPER SHOT, 4-6MM (0.16-0.24IN), PURATRONIC®, 99.999% (METALS BASIS) | ||||
| 44 | COPPER FOIL, 1.0MM (0.04IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | ||||
| 45 | Copper 65, ^6^5Cu, plasma standard solution, Specpure|r, ^6^5Cu 10^mg/ml | Copper 65, ^6^5Cu, plasma standard solution, Specpure|r, ^6^5Cu 10^mg/ml | |||
| 46 | COPPER FOIL, 0.025MM (0.001IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) | ||||
| 47 | COPPER TUBING, 6.35MM (0.25IN) OD, 4.72MM (0.186IN) ID, 99.9% (METALS BASIS) | COPPER TUBING, 6.35MM (0.25IN) OD, 4.72MM (0.186IN) ID, 99.9% (METALS BASIS) | |||
| 48 | COPPER TUBING, 3.175MM (0.125IN) OD, 1.5MM (0.059IN) ID, 99.9% (METALS BASIS) | COPPER TUBING, 3.175MM (0.125IN) OD, 1.5MM (0.059IN) ID, 99.9% (METALS BASIS) | |||
| 49 | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.99% (METALS BASIS) | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.99% (METALS BASIS) | |||
| 50 | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.996% (METALS BASIS) | COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.996% (METALS BASIS) | |||
| 51 | COPPER SLUG, 3.175MM (0.125IN) DIA X 3.175MM (0.125IN) LENGTH, 99.995% (METALS BASIS) | COPPER SLUG, 3.175MM (0.125IN) DIA X 3.175MM (0.125IN) LENGTH, 99.995% (METALS BASIS) | |||
| 52 | COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) | COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) | |||
| 53 | COPPER PLATE, IRREGULAR, NOMINAL 10X34X0.6CM (4X13.5X0.25IN), PURATRONIC®, 99.999% (METALS BASIS) | ||||
| 54 | 1325-32-2 | Copper, diazotized 2-methoxy-4-nitrobenzenamine-4-[(8-hydroxy-6-sulfo-2-naphthalenyl)amino]benzoic acid coupling products complexes | C.I.25040 Saturn Grey LVG C.I.Direct Black 71 Aizen Primula Grey VGLH Direct Lightfast Grey SM Direct black 71 (C.I. 25040) Copper, diazotized 2-methoxy-4-nitrobenzenamine-4-[(8-hydroxy-6-sulfo-2-naphthalenyl)amino]benzoic acid coupling products complexes | ||
| 55 | 90294-97-6 | Copper, diazotized 4-amino-3-hydroxy-7-nitro-1-naphthalenesulfonic acid-diazotized o-toluidine-resorcinol coupling products complexes | Copper, diazotized 4-amino-3-hydroxy-7-nitro-1-naphthalenesulfonic acid-diazotized o-toluidine-resorcinol coupling products complexes | ||
| 56 | 99148-46-6 | Copper, diazotized 3-amino-4-methoxybenzenesulfonic acid-diazotized 4-nitro-1,3-benzenediamine-resorcinol coupling products ammonium sodium complexes | Einecs 308-952-1 Copper, diazotized 3-amino-4-methoxybenzenesulfonic acid-diazotized 4-nitro-1,3-benzenediamine-resorcinol coupling products ammonium sodium complexes | ||
| 57 | 92908-13-9 | Copper, diazotized 3-amino-5-chloro-4-hydroxybenzenesulfonic acid-2,2'-(1,2-ethenediyl)bis[5-nitrobenzenesulfonic acid]-3-methoxybenzenamine coupling products complexes | Copper, diazotized 3-amino-5-chloro-4-hydroxybenzenesulfonic acid-2,2'-(1,2-ethenediyl)bis[5-nitrobenzenesulfonic acid]-3-methoxybenzenamine coupling products complexes | ||
| 58 | 99148-45-5 | Copper, diazotized 3-amino-4-hydroxybenzenesulfonic acid-diazotized 2-(4-aminophenyl)-6-methyl-7-benzothiazolesulfonic acid-resorcinol coupling products ammonium sodium complexes | Einecs 308-951-6 Copper, diazotized 3-amino-4-hydroxybenzenesulfonic acid-diazotized 2-(4-aminophenyl)-6-methyl-7-benzothiazolesulfonic acid-resorcinol coupling products ammonium sodium complexes | ||
| 59 | 72480-58-1 | Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes | Copper, C.I. Natural Yellow 11-diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-(4-aminophenyl)amino-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzenamine coupling products complexes Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes |
| ID | CAS | Product Name | Suppliers | Descriptions |
|---|