61788-97-4
Epoxy resins
CAS: 61788-97-4
Molecular Formula: C21H23ClFNO2
61788-97-4 - Names and Identifiers
61788-97-4 - Physico-chemical Properties
| Molecular Formula | C21H23ClFNO2 |
| Molar Mass | 375.8642232 |
| Appearance | Uncured resins are longchainedprepolymers that are viscous liquids orsolids; the cured resins are strong, solidpolymers |
| Use | For the preparation of anti-corrosion coatings, powder coatings, inks, adhesives, insulating materials |
61788-97-4 - Risk and Safety
| Hazard Symbols | Xi - Irritant N - Dangerous for the environment  |
| Risk Codes | R43 - May cause sensitization by skin contact R36/37 - Irritating to eyes and respiratory system. |
| Safety Description | S24/25 - Avoid contact with skin and eyes. |
61788-97-4 - Upstream Downstream Industry
61788-97-4 - Nature
Open Data Verified Data
phenolic epoxy resin with high viscosity (5Pa at 66 ℃. s) product, molecular weight 600, epoxy functionality 2.5 ~ 6.o, relative density 1. 22, chlorine content 0.249%, volatile 0. 3%. The cured product has excellent thermal stability and mechanical strength, good electrical insulation, corrosion resistance and anti-aging properties. Such as cast plastic heat distortion temperature of more than 300 deg C. Glass fiber cloth laminated plastic tensile strength (room temperature) up to 462. 56MPa,260 ℃ for 196MPa; Bending strength (room temperature) 619.36MPa;260 ℃ for 113. 68MPA; Compressive strength 75. 46MPa; Volume resistivity 3 × l014 Q.cm, dielectric strength 11. 6MV/m, dielectric loss tangent 0.0076.
Last Update：2024-01-02 23:10:35
61788-97-4 - Preparation Method
Open Data Verified Data
A certain amount of phenol and water was first added to the reactor, and a little sulfuric acid was added as a catalyst, then formaldehyde was added, and the reaction was carried out at 75 to 80 ° C. For several hours. After completion of the polycondensation reaction, the low-molecular-weight novolac resin is obtained by washing with warm water until neutral and separating out water. An excess of Epichlorohydrin was then added to dissolve the reaction, followed by the addition of sodium hydroxide, and the cyclization reaction was carried out at 55-60 °c.
Last Update：2022-01-01 11:09:43
61788-97-4 - Use
Open Data Verified Data
The product has large molecular weight, high viscosity and good heat resistance. It can be used to make laminated products, glass fiber reinforced plastic products and electronic components, special purpose of anti arc, heat resistance, insulation and other aspects of the parts. Used for aerospace industry with high temperature laminated structure parts, electronic and electrical industrial parts, heat-resistant and anti-corrosion winding pipe, experimental table and electrical packaging, sealing parts and high temperature adhesive.
Last Update：2022-01-01 11:09:44
61788-97-4 - Safety
Open Data Verified Data
The liquid resin is packed in a tinplate drum, 20kg per barrel; The solid (or semi-solid) resin is packed in a polyethylene film bag, and the outer package is a cardboard drum, with a net weight of 20kg per barrel. The storage warehouse should be kept ventilated, dry and cool to prevent direct sunlight exposure, and should be isolated from fire and heat sources, and should not be stacked in the open air. Avoid getting wet and soaking in water. Non-toxic, non-hazardous materials can be stored and transported. Product storage period of 1 years. If it is late, it can be tested according to the inspection method specified in the product quality standard. If it meets the quality standard, it can still be used. During loading and unloading, the container should be lifted with light weight to prevent breaking of the container. No inversion and compression of heavy objects shall be allowed during stacking or stacking.
Last Update：2022-01-01 11:09:45
61788-97-4 - Molding Process
Open Data Verified Data
similar to the bisphenol A type epoxy resin, it can be processed by casting, transfer molding and press molding.
Last Update：2022-01-01 11:09:44
61788-97-4 - Reference Information
| EPA chemical substance information | information provided by: ofmpeb.epa.gov (external link) |
| Overview | where the molecular structure of polymer compounds containing epoxy groups are collectively referred to as epoxy resin. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the surface of metal and non-metallic materials, good dielectric properties, small shrinkage rate and good dimensional stability, high hardness, good flexibility, alkali and most of the solvent stability, and thus widely used in national defense, national economy departments, for casting, dipping, laminating materials, adhesives, coatings and other purposes. China has studied epoxy resin since 1958, and has been put into industrial production at a very fast speed. It has been developing vigorously all over the country, in addition to the production of ordinary bisphenol A- epichlorohydrin epoxy resin, still produce various types of new epoxy resin, in order to meet the national defense construction and economic sectors of the urgent need. The preparation methods of epoxy resins are roughly of the following types: reaction of activated hydrides with epichlorohydrin, liquid phase oxidation of double bonds with hydrogen peroxide or peracid (e. G. Peracetic acid), air oxidation of double bond compounds. |
| molecular structure | epoxy resin (EP) for short is a general term for resins having two or more epoxy groups in the molecular structure. Regardless of the long or short molecule, the two ends of the bond are basically epoxy groups, and the functionality of the epoxy group is 2, and the three-dimensional network structure can be formed after crosslinking and curing agent, so epoxy resin is a type of polymer compounds. Depending on the degree of polymerization, it can be classified as liquid or solid. Because the epoxy Group is a ternary ring, this kind of ternary ring is easy to open and has a strong reactivity, and many characteristics of epoxy resin are generated. The most important type of epoxy resin is the bisphenol A epoxy propyl ether epoxy resin formed by the condensation of epoxy chloropropane and bisphenol A; In addition, there are epoxy resins made by the reaction with the compounds containing the olefin bond. n in the molecular structure formula of bisphenol A epoxy propyl ether epoxy resin indicates the degree of polymerization. The larger the n, the longer the molecular chain, the higher the relative molecular mass and the more hydroxyl groups. n is generally between 0 and 14, and the relative molecular mass is between 340 and 3750. The relative molecular mass of the epoxy resin with small n value is small, the epoxy value (epoxy group contained per 100g resin) is relatively high, and the low relative molecular mass is a viscous liquid, with the increase of n value, the viscosity increases, and when the relative molecular mass exceeds 1000, it becomes a solid. Because the epoxy resin is cured by the epoxy groups at both ends of the molecule, the molecular chain is longer (I. E., the epoxy value is relatively reduced). The cross-linking degree of the polymer film after curing is relatively small, and although the flexibility is increased, the high temperature performance is reduced. The melting point increases with the increase of relative molecular mass, the average relative molecular mass is 600, the melting point is 40 ℃, 900 70 ℃, 1400 100 ℃, 2900 130 ℃, 3750 150. Epoxy resin was odorless. Tasteless. Acid resistant. Alkali resistance. Insoluble in water, methanol and ethanol. Soluble in acetone, cyclohexanone, toluene, styrene, esters, ether alcohols, chlorinated hydrocarbons and other organic solvents. The solubility in organic solvents decreases with increasing relative molecular mass of the resin. Adhesion, heat resistance, insulation, hardness, toughness are very good. The main chain of the molecule is composed of carbon-carbon bond, ether bond and bisphenol bond, and contains two active groups of hydroxyl group and epoxy group, which can react with many other compounds and resins, this is very valuable for the manufacture of coatings. For example, they can react with polyamines, amides, phenols, carboxyl groups, hydroxyl groups, silicones, organic titanium and inorganic acids, and can also be crosslinked with many curing agents to form a three-dimensional network structure. |
| application classification | 1, glycidyl epoxy resin: glycidyl epoxy resin and diphenolic propane epoxidation resin, it has low viscosity, good use process; High reactivity; High adhesion than general epoxy resin, the cured product has good mechanical properties; Good electrical insulation; Good weather resistance, and good resistance to ultra-low temperature. Under ultra-low temperature conditions, it still has higher bond strength than other types of epoxy resins. Good surface gloss, light transmission, good weather resistance. 2, glycidyl amine epoxy resin: the advantages of this type of resin is multi-functionality, high epoxy equivalent, cross-linking density, heat resistance significantly improved. The superior adhesion and heat resistance of glycidyl amine epoxy resin have been used at home and abroad to manufacture carbon fiber reinforced composite materials (CFRP) for aircraft secondary structure materials. 3, alicyclic epoxy resin: this kind of epoxy resin is prepared by epoxidation of double bonds of alicyclic olefins, their molecular structure is very different from that of diphenolic propane type epoxy resin and other epoxy resins. The former epoxy group is directly connected to the alicyclic ring, the epoxy Group of the latter is linked to the benzene core or aliphatic hydrocarbon by epoxy propyl ether. The cured alicyclic epoxy resin has the following characteristics: (1) high compression and tensile strength; (2) Long-term exposure under high temperature conditions can still maintain good mechanical properties; (3) arc resistance, UV aging resistance and good weather resistance. 4, aliphatic epoxy resin: this kind of epoxy resin in the molecular structure of not only no benzene nucleus, also no alicyclic structure. Only the aliphatic chain, the epoxy group is linked to the aliphatic chain. Epoxidized polybutadiene resin after curing strength, toughness, adhesion, resistance to positive and negative temperature properties are good. |
| use and function | epoxy resin is widely used as adhesives, anti-corrosion materials, insulating coatings, laminates, casting and impregnating materials, molding materials, etc. It can also be used as glass fiber reinforced plastics, electrical precision parts, shock-resistant sound-absorbing materials, textile finishing agents. In the aspect of coating, it is mainly used as metal protective coating for ships, steel components, metal containers and other protective coatings. In addition, as a carrier agent of cationic electrophoretic coating, it is widely used for the bottom coating of automobile body; widely used in electrical insulation paint, injection molding materials, molding materials, especially in the electronics industry, in addition to the laminate, widely used as LSI, IC and other sealing materials; it is used as a non-slip dressing, floor material and mortar material for concrete casting roads in civil engineering and construction. As an adhesive, it is widely used in metal and non-metal materials (such as ceramics, glass, wood, etc.) bonding; Also used as a resin, polyvinyl chloride stabilizer; Textile treatment agent, can prevent wrinkling, scale. |
| preparation method | the preparation method of epoxy resin can be summarized as two methods, one is a compound containing active hydrogen, such as compounds containing hydroxyl, carboxylic acid group, amino group and the like, which reacts with compounds containing epoxy group (such as epichlorohydrin) under the catalysis of base, the introduction of epoxy groups, such as the preparation of bisphenol A type Epoxy propyl ether epoxy resin, belongs to this class; The second is to contain the olefin bond compounds such as tetrahydrophthalic acid, cyclohexene and other raw materials, epoxidation of the olefinic bond with a peroxide to form an epoxy group, such as an epoxy resin prepared by reaction with an olefinic bond-containing compound, is of this type. The synthesis of bisphenol A type Epoxy resin is different due to the relative molecular mass. Low relative molecular mass of liquid epoxy resin, bisphenol A in the role of potassium hydroxide (sodium), with an excess of Epichlorohydrin reaction, so that epoxidation. In order to inhibit the formation of high molecular weight compounds and the hydrolysis of epichlorohydrin, the alkali solution should be slowly added. For epoxy resins of medium relative molecular mass, a one-step method is used. That is, bisphenol A (or other base) dissolved in sodium hydroxide, then gradually add epichlorohydrin reaction, this method can save the amount of epichlorohydrin. For high molecular weight epoxy resin, there are two methods: one is a one-step method. Bisphenol A is dissolved in sodium hydroxide, then epichlorohydrin is added, and then a part of sodium hydroxide is added, and finally dehydration is refined. The second is a two-step method, which is to add bisphenol A to the prepared epoxy resin, it is further reacted to increase the relative molecular mass, because the two ends of the epoxy resin are epoxy groups, which can react with bisphenol A under certain conditions. |
| epoxy resin adhesive | epoxy resin adhesive, commonly known as "universal adhesive", is a kind of high strength adhesive widely used, by epoxy resin as the main body, adding curing agent and so on, it has excellent adhesion and adhesive strength to many materials. Commonly used curing agents are amines, anhydrides, amides and so on. Various auxiliary materials may be added to accommodate different needs. Its main component is different molecular weight, different chemical structure of epoxy resin, and then add the curing agent (such as amines, acid anhydride and other polymer compounds) to make the curing into insoluble body type crosslinking structure, shorten the process time; Add plasticizer or Polysulfide rubber, nitrile rubber, nylon polyamide resin and other improvements to Overcome Brittleness, improve toughness; Add phenolic resin, organic silicon compounds to improve heat resistance; addition of different inorganic fillers reduces shrinkage and internal stress during hardening. Epoxy resin adhesives can be divided into two types: Room temperature curing type and heat curing type according to the types of curing agents used. There are great differences in the bonding properties, process and curing conditions of various types. Used for bonding metal, glass, plastic, ceramic, etc. Epoxy resin adhesive is a compound containing epoxy groups at both ends with different molecular weights. The most typical and widely used resin is a resin synthesized from bisphenol A and epichlorohydrin, and its chemical structure is: epoxy resins are reactive with a variety of curing agents, and therefore have adhesion to a variety of substrates, and can be adapted to different curing temperatures (from room temperature to high temperature) and end-use performance requirements. Epoxy resin curing process without by-products emissions, small volume shrinkage, with electrical properties, chemical resistance, solvent resistance and other characteristics. In addition to the above structure, there are linear phenolic epoxy resin and long chain aliphatic epoxy resin, which are mainly used in combination with bisphenol-A epoxy resin. The former can improve the crosslinking density and enhance the chemical resistance, the latter is used to improve the flexibility of the adhesive. The flame-retardant epoxy resin adhesive can be prepared by the Bisphenol-A containing halogen substituent. |
| epoxy resin coating | epoxy resin coating with epoxy resin as the main film-forming material coating. It is divided into solvent type (which is divided into three types: Amine curing type, synthetic resin curing type, fatty acid esterification type), solvent-free type, powder type and linear type. Epoxy resin itself is thermoplastic, to make the epoxy resin into a useful coating, it is necessary to make the epoxy resin and curing agent or vegetable oil fatty acid reaction, cross-linking into insoluble and infusible three-dimensional network structure, in order to show a variety of excellent performance. There are many types of this coating, each has its own characteristics, summarized its advantages are: strong adhesion, especially the adhesion to the metal surface is stronger, this is because the structure contains aliphatic hydrocarbon groups, for the reason of ether bond and very active epoxy group, the first two groups generate attractive force between the adjacent two sides, and the epoxy group reacts with the surface of the metal containing active hydrogen to generate chemical bonds, and forms a three-dimensional network structure, its chemical resistance is excellent, especially better alkali resistance, this feature is better than phenolic resin coating, polyester coating, in addition, corrosion resistance, insulation, color retention and thermal stability are good. The disadvantages include: easy pulverization of the coating film, poor weather resistance, poor leveling, and slightly poor abundance of the coating film. epoxy resin coatings are widely used in factory building coatings (protective coatings for steel structures), packaging container coatings (hoses such as toothpaste, can inner wall coatings), household appliances primer coatings (washing machines, refrigerator, electric oven, sewing machine, electric fan, steel furniture, etc.), traffic vehicle paint (aircraft, car, bicycle, agricultural machinery, diesel locomotive, etc.), ship paint (Hull, deck, the inner wall of the ship, etc.), electrical insulation coatings, anti-corrosion coatings (chemical plant tanks, tanks, containers, pipes, etc.). |
| Use | for the preparation of anti-corrosion coatings, powder coatings, inks, adhesives, insulating materials, etc. |
Last Update：2024-04-09 21:21:28
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