Molecular Formula | C4H8N2O2S |
Molar Mass | 148.185 |
Density | 1.49±0.1 g/cm3(Predicted) |
Melting Point | 183-184 °C |
Boling Point | 323.4±44.0 °C(Predicted) |
Storage Condition | Room Temprature |
Sensitive | Easily absorbing moisture |
MDL | MFCD00020520 |
Use | Applications nickel brightener, nickel plating to improve the ability to cover low current areas, impurity tolerance agent. It can improve the deep plating ability of high and low areas, and has anti-impurity effect, which will lead to loss of light when the dosage is large. |
Yang Qiong , Chen , Wang Hao , Cao Quangen
Abstract:
The effects of different concentrations of S-carboxyethyl isothiourea (ATPN) on the deposition rate and surface morphology of acidic electroless nickel plating were studied, the anodic and cathodic processes of chemical nickel were studied by polarization curves. The results show that ATPN can make the coating surface Crystal fine. When the addition amount of ATPN is less than 11 mg/L, ATPN reduces the adsorption energy of hypophosphite on the surface of nickel through the electronic effect of S atom in its molecule, the oxidation of sodium hypophosphite is accelerated, and the deposition rate of electroless nickel plating is accelerated. When the addition amount of ATPN exceeds 11 mg/L, ATPN and nickel form a very stable surface adsorption complex, which reduces the adsorption of sodium hypophosphite on the surface of nickel, the sodium hypophosphite oxidation was inhibited and the deposition rate decreased. When the nickel surface is completely covered by the ATPN, no plating or no plating occurs. The suitable dosage of ATPN is 8~13 mg/L.
Key words:
acidic electroless nickel plating S-carboxyethyl isothiuronium salt Plating rate mechanism
DOI:
10.3969/j.issn.1004-227X.2014.08.003
cited:
year:
2014