butyl(triethoxy)silane
butyl(triethoxy)silane
CAS: 4781-99-1
Molecular Formula: C10H24O3Si
butyl(triethoxy)silane - Names and Identifiers
| Name | butyl(triethoxy)silane |
| Synonyms | Triethoxybutylsilane butyl(triethoxy)silane Triethoxy(butyl)silane silane, butyltriethoxy- N-Butyltriethoxy Silane Silane, butyltriethoxy- |
| CAS | 4781-99-1 |
| EINECS | 200-258-5 |
| InChI | InChI=1/C10H24O3Si/c1-5-9-10-14(11-6-2,12-7-3)13-8-4/h5-10H2,1-4H3 |
butyl(triethoxy)silane - Physico-chemical Properties
| Molecular Formula | C10H24O3Si |
| Molar Mass | 220.38 |
| Density | 0.887 |
| Boling Point | 180.1℃ |
| Flash Point | 69.6℃ |
| Vapor Presure | 1.24mmHg at 25°C |
| Appearance | clear liquid |
| Specific Gravity | 0.8883 |
| Color | Colorless to Almost colorless |
| Sensitive | 7: reacts slowly with moisture/water |
| Refractive Index | 1.4011 |
butyl(triethoxy)silane - Synthesis and characterization of n-butyl triethoxysilane
from Baidu library
Summary:
n-butyl triethoxysilane was synthesized by Grignard reagent method with ethyl orthosilicate, magnesium and n-butane bromide as raw materials and iodine as initiator, and characterized by IR and NMR. The optimal reaction conditions are as follows: temperature 155 ℃, ratio of reactant n(Mg)n(TEOS)n(C4H9Br) 1:1.2:1, reaction time 3h.
keywords:
n-butyltriethoxysilane ethyl orthosilicate n-butane bromide magnesium/p>
DOI: 10.3969/j.issn.1009-4369.2006.04.005
Last Update：2023-08-16 23:40:12
butyl(triethoxy)silane - Nature
| boiling point | 180.1℃ |
| density | 0.887 |
| refractive index | 1.4011 |
| flash point | 69.6℃ |
| Specific gravity | 0.8883 |
| hydrolysis sensitivity | 7: reacts slowly with moisture/water |
Last Update：2024-04-19 10:01:13
butyl(triethoxy)silane - A conductive adhesive for LED and its preparation method [invention patent]
application (patent) number:
CN201610976755.4
date of application:
2016.11.08
public/announcement number:
CN106520010A
Applicant (patentee):
Tongling zhongrui electronic technology co., ltd
Summary:
P> the present invention discloses a conductive adhesive for LED and a preparation method thereof. the conductive adhesive is proportioned in parts by weight according to each component as follows: dihydrogen hypophosphite, silver powder, sucrose octaacetate, dioctyl sebacate, 3-dimethoxypropylamine, n-butyl trimethoxysilane, & gamma;-mercaptopropyl triethoxysilane, benzoin ether, p-tert-butyl phenol, 4-dihydrodiol, cyclohexanone, mix dihydrogen hypophosphate with sucrose octaacetate, n-butyltrimethoxysilane, cyclohexanone and 2-butene-1, 4-diol, and then put it into a centrifuge Centrifugally mix, then add benzoin diethyl ether, p-tert-butylphenol and silver powder to stir, then put the remaining raw materials into a vacuum reactor to react, centrifugally. The invention uses conductive adhesive to glue the pins and solder joints of the LED after welding, improves the conductive performance, does not affect the strength of the package, and can achieve the moisture-proof effect.Sovereignty Item:
1. A conductive adhesive for LED, characterized in that the raw material components are: 200-350 parts of dihydrogen hypophosphite, 150-200 parts of silver powder, 6-12 parts of sucrose octaacetate, 8-17 parts of dioctyl sebacate, 4-14 parts of 3-dimethoxypropylamine, 26-37 parts of n-butyl trimethoxysilane, 14-44 parts of gamma;-Mercaptopropyltriethoxysilane, 10-20 parts benzoin ether, 16-28 parts p-tert-butyl phenol, 25-37 parts methyl-isobutyl methanol, 10-25 parts 2-butene-1, 4-diol, and 10-20 parts cyclohexanone.
Last Update：2024-04-10 22:29:15
