Molecular Formula | C11H28N2O3Si |
Molar Mass | 264.44 |
Density | 0.97 |
Melting Point | 135°C (5 mmHg) |
Boling Point | 273°C |
Flash Point | 123°C |
Water Solubility | 240g/L at 20℃ |
Vapor Presure | 0.03Pa at 25℃ |
Appearance | clear liquid |
Specific Gravity | 0.97 |
Color | Colorless to Almost colorless |
pKa | 10.00±0.19(Predicted) |
Storage Condition | 2-8℃ |
Sensitive | 7: reacts slowly with moisture/water |
Refractive Index | 1.438 |
Use | Suitable for coupling of thermosetting resins such as epoxy, phenolic, melamine and hot melt resins such as polystyrene, polyamide and so on |
Risk Codes | 36/37/38 - Irritating to eyes, respiratory system and skin. |
Safety Description | S26 - In case of contact with eyes, rinse immediately with plenty of water and seek medical advice. S36/37/39 - Wear suitable protective clothing, gloves and eye/face protection. S24/25 - Avoid contact with skin and eyes. |
TSCA | Yes |
HS Code | 29319090 |
LogP | 1.2 at 20℃ |
EPA chemical information | Information provided by: ofmpub.epa.gov (external link) |
Uses | N-(2-aminoethyl)-3-aminopropyltriethoxysilane is a colorless or yellowish transparent liquid, soluble in benzene, Ethyl acetate, react with water. It is mainly used to couple organic polymers and inorganic substances to chemically bond the two into a whole to improve the various physical and mechanical properties, electrical properties, water resistance, aging resistance, etc. of the polymer. It is suitable for coupling The polymers include thermosetting resins, such as epoxy, phenolic, polyurethane, melamine, nitrile phenolic; hot melt resins, such as polystyrene, polyvinyl chloride, polyamide; elastomer polysulfide rubber, polyurethane rubber, etc. It mainly improves the performance of epoxy, phenolic, melamine, furan and other resin laminates, and is also effective for polypropylene, polyethylene, polyacrylic acid, silicone, polyamide, polycarbonate, and polycyanide. To be used as a glass fiber finishing agent, it is also widely used in glass beads, white carbon black, talc, mica, clay, fly ash and other silicon-containing substances. |
use | suitable for coupling thermosetting resins such as epoxy, phenolic, melamine and hot melt resins such as polystyrene, polyamide, etc. |